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Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding

Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding

Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding
Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding

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Détails sur le produit:
Lieu d'origine: Chine
Nom de marque: ZG
Certification: CE
Numéro de modèle: MS
Conditions de paiement et expédition:
Quantité de commande min: 1 pièce
Prix: 10USD/PC
Détails d'emballage: Boîte en bois forte pour l'expédition mondiale
Délai de livraison: 5-8 jours ouvrables
Conditions de paiement: D/A, L/C, D/P, T/T, Western Union, MoneyGram
Capacité d'approvisionnement: 1000 pièces

Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding

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High Machining Efficiency Ceramic Lapping Discs

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Good Flatness Ceramic Grinding Discs

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Double-Sided Grinding Ceramic Polishing Discs

Ceramic Lapping Discs
This advanced ceramic disc series is engineered for precision carving, thinning, shaping, beveling, and polishing of gemstones, ceramics, and crystals. The product line includes grinding discs, files, grinding plates, and resin discs designed for industrial manufacturing applications.
Semiconductor Silicon Wafer Processing
Ceramic grinding discs represent the most advanced method for processing semiconductor silicon wafers. The double-sided grinding process utilizes ceramic discs to significantly enhance wafer quality through optimized grinding parameters including disc material composition, grinding fluid selection, pressure control, and rotational speed.
By replacing traditional cast iron discs with ceramic alternatives, manufacturers eliminate surface scratches and contamination, minimize metal ion introduction, reduce subsequent processing requirements, shorten etching times, improve production efficiency, and significantly decrease silicon wafer processing losses—dramatically increasing overall utilization rates.
Product Specifications & Features
  • Primary Utility: Precision thickness reduction of gemstones and materials
  • Construction: Metal bond and vitrified bond configurations
  • Grit Sizes: 350# and 600# options available
  • Disc Diameters: Range from 400mm to 960mm
  • Key Advantages: Exceptional machining efficiency and superior product flatness
Physical Performance Indicators
Performance Metric ZG Ceramics Domestic Level International Standards
Density (g/cm³) 3.97 3.81-3.93 3.9-3.94
Purity (%) 99.9 98-99.8 99.5-99.9
Vickers Hardness (GPa) 17 14-15 16-17.5
Three-Point Bending Strength 520 300-350 330-400
Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding 0

Coordonnées
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

Personne à contacter: Daniel

Téléphone: 18003718225

Télécopieur: 86-0371-6572-0196

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